Multiple Value Logic Element

VIRTUALLY ALL PRESENT DIGITAL ICs ARE BASED ON BINARY LOGIC. THE CONSTRAINTS IN TERMS OF INCREASED DENSITY CENTER AROUND ISSUES OF COMPLEXITY IN DESIGN, LOSS THROUGH ADDITIONAL INTERCONNECTS, POWER DISSIPATION, ETC. CONCOMITANT TO BINARY ICs HAS BEEN THE NOTION THAT THE INTRODUCTION OF LOGIC ELEMENTS WITH MULTIPLE STATES COULD REDUCE THE COMPLEXITY OF THE DESIGN, REDUCE THE NUMBER OF INTERCONNECTS, AND IMPROVE THE SPEED AND OUTPUT OF THE IC. MULTIPLE VALUE LOGIC (MVL) ELEMENTS CONTRUCTED FORM RESONANT TUNNELING DIODES (RTD) HAVE ALREADY BEEN DEMONSTRATED. TO ESTABLISHED A TECHNOLOGY BASED UPON RTD-MVL STRUCTURES ROBUST DEVICE DESIGN MUST BE IMPLEMENTED ESTABLISHING THE RELIABLE SPEED ADVANTAGES AND DENSITY INCREASES. U.S. PATENT 5,128,894 BY H.C. LIN ESTABLISHES THE PROCEDURES FOR ROBUST DEVICE AND CIRCUIT DESIGN, FOR THREE AND 'N'-STATE LOGIC. THIS PROPOSAL USING THE COMBINED DESIGN PROCEDURES OF SCIENTIFIC RESEARCH ASSOCIATES (WITH DENMAT, A QUANTUM TRANSPORT CODE) AND THE FABRICATION AND TEST FACILITIES AT THE UNIVERSITY OF MARYLAND (THE STAFF OF H.C. LIN) WILL ESTABLISH THE FEASIBILITY OF HIGH SPEED MVL-RTD.