PASSIVE THERMAL MANAGEMENT THROUGH THE USE OF ULTRA-HIGH THERMAL CONDUCTIVITY FIBERS

THERE IS A GREAT NEED FOR ADVANCED MATERIALS DEVELOPMENT IN THE AREA OF ADVANCED ELECTRONICS. THE SPECIFIC AREA OF INTEREST IN THIS PROJECT IS THE USE OF NEW MATERIALS TO HELP DISSIPATE HEAT FROM ELECTRONICS. WITH THE ADVENT OF VHSIC AND EVEN MORE ADVANCED ELECTRONIC SYSTEMS AND WITH THE DEVELOPMENT OF ADVANCED SUPERCONDUCTORS, IT IS CRUCIAL TO GIVE THE DESIGNER THE ABILITY TO MANAGE EXTREMELY HIGH AND RAPIDLY GENERATED HEAT LOADS. THIS EFFORT WILL FOCUS ON THE DEVELOPMENT OF TEXTILES WOVEN FROM ULTRA-HIGH THERMAL CONDUCTIVITY REINFORCING FIBERS. THESE TEXTILES AND THE RESULTING COMPOSITES WILL GIVE THE DESIGNER A PASSIVE THERMAL MANAGEMENT SYSTEM WHICH CAN BE USED TO CHANNEL THERMAL LOADS WHILE PROVIDING REINFORCEMENT TO THE CIRCUIT BOARD. UNDER THIS EFFORT, THE TECHNOLOGY TO WEAVE FABRICS AND PREFORMS WILL DEVELOPED INCREASINGTHE EFFICIENCY OF PRODUCING CIRCUIT BOARDS FROM THESE MATERIALS, REDUCING THE COST OF THE BOARDS, AND INCREASING THE THERMAL EFFICIENCY OF THE BOARDS.