Passive Phased Array Antenna construction by Application of a Novel Micromachined Packaging Technique

A novel structure based on silicon micromachining is presented which is capable of forming three-dimensionally integrated packaging for millimeter wave circuits. Such packages would incorporate multiple chips, and interconnect them with an integrated antenna. It is proposed to apply this structure to the fabrication of phased array antennas where half wavelength element spacing is desired. BENEFITS: Commercial applications in millimeter waves are rapidly expanding. Local multipoint distribution systems are being developed at 28 and 40 GHz for wireless delivery of data and video. Also, automotive radars are being developed at 77 GHz. This novel packaging system has the potential to greatly reduce assembly costs for multichip RF modules at millimeter waves, due to its use of wafer scale assembly and test