Miniature, Robust Stripline Bandpass Filters For Mobile

THE OBJECTIVE OF THIS PROGRAM IS TO BUILD A MICROWAVE BANDPASS FILTER WITH CERAMIC MULTILAYER PACKAGING TECHNOLOGY IN ORDER TO CREATE A LIGHT WEIGHT, LOW VOLUME, TEMPERATURE STABLE FILTER. STRATEDGE PACKAGING TECHNOLOGY CAN ADVANCE THE STATE-OF-THE-ART IN MINIATURE PASSIVE MICROWAVE COMPONENTD USING HIGH DIELECTRIC CONSTANT, LOW LOSS (HIGH-Q) CERAMIC SUBSTRATES. A FILTER IS SELECTED AAS THE CIRCUIT OD CHOICE BECAUSE IT IS USED IN AVAST ARRAY OF ELECTRONIC SYSTEMS. INCORPORATION OF THESE MULTILAYER CERAMIC CIRCUITS IN T/R MODULES OR MULTICHIP MODULES PRESENTS A PRACTICAL OPTION TO THE CIRCUIT DESIGNER. THE DEVICES CAN BE INCORPORATED IN A MODULAR FASHION IN HIGHLY INTEGRATED DESIGNS. THE POTENTIAL OF COMBINING THE STRIPLINE SUBSTRATES INTO THE PACKAGE ITSELF WOULD BE ADDRESSED UNDER A PHASE II EFFORT.