Phosphoryl-Based Nanoscale Appliques

A novel appliqu¿ formulation is described whose polymer backbone is designed to possess excellent adhesive qualities over a wide range of temperatures, at least -65 to +350oF. By design the polymer will be low cost. This polymer is derived from ongoingmembrane research at Phoenix Innovation that has identified a polymer formulation that adheres tenaciously to a variety of substrates and is inherently thermally stable and retains useful physical properties at low temperatures. There are many possible Federal and commercial applications for appliqu¿s that include aircraft, as well as a range of adhesives that must perform well in many different sets of environmental conditions.