Heat Removal Device for Munition

"Advanced Future Munition (FM) as well as chip and board level space or munition electronics or optoelectronics will require innovative heat removal solutions to enable them to meet size, weight, power, high reliability, and low cost. Commonly, theseapproaches are based on efficient 2-D and 3-D arrangements of electronics, often involving "multi-chip modules" (MCMs). As chips are brought closer together, the area/volume power densities and, therefore, heat increases. MS Technology (MST) proposes a new type of heat removal modular device, which could solve space or munition electronic packaging problems of the FM and large scale electronic and optoelectronics systems. This new approach removes the generated heatfirst converting it to electricity which could be dissipated in a shunt resistor far from the device or supplement the main system power supply. This supplementary power source further increases reliability, reduces cost and weight of the entire system. MST will evaluate and develop conceptual designs for this new device that should provide significant thermal management improvements compared to the thermal management techniques used in heat removal approaches now. MST will conduct proof of conceptdemonstrations to indicate the practicality of such techniques for use in device electronic systems. A low cost high performance heat removal modular device, will find commercial application in projects of interest to gover