SBIR/STTR Research Award

HIGH DENSITY ELECTRONIC PACKING CONCEPTS

Award identifier cb01a6761115a480f90dabc9fc28ced84de7c512032a00b05dfcaf55ff23f010Awarding agency Department of Defense · Navy

Award amount

$46,082

Program and phase

SBIR · Phase I

Award year

1989

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Award details

Awarding agency
Department of Defense
Branch
Navy
Recipient company
Microcom Corp
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

MICROCOM PROPOSES TO STUDY A VERY HIGH SPEED (100 TO 800 MBITS/SEC) DATA LINK WHICH WILL SAMPLE AND STORE PARALLEL DATA AND CONTROL INPUTS AND TRANSMIT THEM SERIALLY TO A REMOTE DESTINATION WHERE THE INFORMATION WILL BE REASSEMBLED IN ORIGINAL FORMAT. THUS A ONE MEDIUM LINK WILL REPLACE HIGH DENSITY MULTIPIN CONNECTORS. STUDY WILL HIGHLIGHT ENVIRONMENTAL CONSIDERATIONS AND COST EFFECTIVENESS.

Technology keywords

Not reported

Agency intelligence

Department of Defense

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