SBIR/STTR Research Award

Metal-Metal Sealing Process for Robust Low-Cost MEMS Packaging

Award identifier 84d75813104e986b466010c7e9f5bdf5071783a621a40879cd7a0c0da9d6922bAwarding agency Department of Defense · Army

Award amount

$119,863

Program and phase

SBIR · Phase I

Award year

2003

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Award details

Awarding agency
Department of Defense
Branch
Army
Recipient company
MICROASSEMBLY TECHNOLOGIES, INC.
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

Wafer scale hermetic metal-metal sealing process provides robust packaging for MEMS and other components. Low bonding temperatures enable CMOS compatibility. This packaging process has been implemented in multiple MEMS applications, including high-gaccelerometers for munitions, automotive accelerometers, and for vacuum packaging high-Q resonators. Military applications include radar and communications applications.Commercial wireless applications include cellphone, WLAN and anticollision radar systems. Low bonding temperatures (down to room temperature) provide CMOS compatibility.

Technology keywords

Not reported

Agency intelligence

Department of Defense

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