Quantitative Techniques for Surface Characterization and Solderability Assessments of OSP - Coated Printed Wiring Board

Objectives of this project include the development of electrochemical techniques for measurement of (i) thinckness of OSP coatings, (ii) amount and type of copper oxides within and under the OSP coating, (iii) protective effectiveness of OSP coatings, and (iv) solderability prediction of OSP-coated PWBs. We will evaluate the effect of major parameters of the coating, storage, and soldering process on solderability of OSP-coated PWBs. In order to improve the interpretation of SERA signals, we will develop standardization procedures and prepare a set of calibration standards. The results will provide a foundation for (i) optimization and control of existing OSPs and their application processes, (ii) development of new processes, and (iii) cost savings in electronics due to solderability loses.