A PHOTOVOLTAIC WIRE GRID DESIGN AND PROCESS

THE CURRENT MANUFACTURING AND PILOT OPERATIONS UTILIZE MODULE ASSEMBLY PROCESSES THAT HAVE RELATIVELY HIGH LABOR AND MATERIAL COSTS. THIS PROJECT ADDRESSES THE COST AND PERFORMANCE ISSES OF PROCESSING THE GRIDS AND BUS BARS USED IN AMORPHOUS SILICON ALLOY THIN FILM PHOTOVOLTAIC MODULES. SPECIFICALLY, PHASE I WILL ADDRESS THE PROBLEMS OF THE SILVER PASTE-BASED CURRENT COLLECTION GRID SYSTEM, WHICH COMPROMISES THE RELIABILITY AND ADDS TO THE COST OF THE AMORPHOUS SILICON PHOTOVOLTAIC MODULES. THIN SOLID COPPER WIRES WILL BE USED AS A COMBINED GRID/BUS BAR SYSTEM WHEREIN THE WIRES SERVE THE DUAL PURPOSE OF COLLECTING THE CURRENT FROM THE TOP CONDUCTOR AS WELL AS CARRYING IT AWAY FROM THE ACTIVE AREA OF THE CELL. THIS NEW GRIDDING PROCESS WILL RESULT IN CHEAPER PHOTOVOLTAIC MODULES THAT USE SIGNIFICANTLY LESS EXPENSIVE MATERIALS AND HAVE INCREASED EFFICIENCES REGARDLESS OF THE SIZE OF THE MODULE. THE MODULES WILL ALSO HAVE IMPROVED ELECTRICAL ISOLATION AS A RESULT OF THE NEW GRID SYSTEM. OVERALL, THIS PROCESS IMPROVEMENT WILL ENHANCE THE PERFORMANCE OF EXISTING MODULE MNAUFACTURING AND PILOT FACILITIES MODULE MANUFACTURING AND PILOT FACILITIES, AND INCREASE THE RELIABILITY AND DECREASE THE COST PER PEAK WATT OF ITS MODULES.