High Speed, Non-Contact Infrared Focal Plane Array Detector Tester

The object of this project is t design and demonstrate the feasibility of a non-contact tester employing electron beams generated by vacuum microelectronics devices (VMDs) to radiometrically test infrared (IR) detector arrays before indium bump bonding to integrated circuit readouts. Previous SBIRs investigated a generic readout for infrared focal plane arrays and demonstrated the concept with photoconductive, photovoltaic, and piezoelectric detectors. this project applies the technology in a non-contact focal plane array detector tester. Specifically, the project will analyze data from previous SBIRs employing VMDs as generic read-outs for infrared focal plane arrays and, from this data, develop a design for High Speed, Non-Contact Infrared Focal Plane Array Detector. The feasibility of this design will then be demonstrated with a single unit photodetector or a thermal detector and a VMD device with drive electronics acting as a non-contact tester. In Phase II, a full-up prototype non-contact tester will be developed and demonstrated with infrared focal plane array detectors.