SBIR/STTR Research Award

Growth of Boron Phosphide for High Temperature Electronic Devices

Award identifier f4c8a7c899cb6f594a05cd4ab100e4d4af815f87ceb353a2c9e003fe2775c354Awarding agency Department of Defense · Missile Defense Agency

Award amount

$49,023

Program and phase

SBIR · Phase I

Award year

1992

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Award details

Awarding agency
Department of Defense
Branch
Missile Defense Agency
Recipient company
Spire Corporation
Proposal award date
Not reported
Contract end date
Not reported
UEI
RG46KJGARZF4
Solicitation number
Not reported
Topic code
Not reported

Research abstract

Invent a material good for transistors running at 2000 degrees Fahrenheit and the world will beat a path to your door. That's what the Spire Corporation hopes wil happen; Spire proposes to take advantage of boron phosphide's potential as a high-temperature, wide-bandgap electronic material. Thin-film boron phosphide isn't easy to grow; the Japanese have been trying for years. Spire thinks the answer is low-pressure chemical vapor deposition. Low pressure will keep gas molecules far enough apart to stop "snow" from forming but will still permit rapid crystal growth, important because 300 micron thick free-standing wafers are the program's goal. Always looking to the marketplace, Spire sees itself as becoming the first on-shore supplier of crystalline boron phosphide.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

429 SBIR/STTR records share this UEI (1983–2014). Reported award amounts total $73,907,551. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, National Science Foundation, Department of Energy, Department of Health and Human Services, Department of Commerce

Agency intelligence

Department of Defense

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