MEMS Packaging for Deep Space Environments Using Nano-structured Polymers

This SBIR project investigated feasibility of nanostructured polymers for improving micro-electromechanical systems (MEMS) packaging for deep space harsh environments. MEMS technology enables development of spacecraft devices and subsystems that are small, low-cost, low mass, low volume, and low power consumption. A Stirling powered microcooler device was studied and investigated in Phase II. MEMS devices offer improvements in spacecraft efficiencies and new mission functionalities, MEMS introduces new challenges directly related to their micro-size and solid-state structure. Space missions require devices to operate in harsh environments with extreme temperatures, debris, planetary atmospheres and electromagnetic radiation. A pervasive issue facing users of MEMS devices in all environments is the availability and design of packaging technologies for ensuring long-term reliability and performance of the devices. This project will develop packaging technologies for MEMS based on innovative polymeric materials that are processable into diamond like carbon and silicon carbide materials. Packaging benefits include:? High wear surfaces? Thermally conductive? Electrically insulating? Anti-stiction? Hard surface? Low porosity? Low coefficient of friction? CTE matched to siliconThese materials are also expected to be low in cost compared to chemical vapor deposition materials and they achieve higher purity and quality.