Carbon-Carbon Heat Sink Components for High Density Electronics Packaging

Carbon-carbon is a unique composite material that achieves the highest in-plane thermal conductivity and also achieves very high young's modulus (40-50 MSI). This research project will demonstrate the feasibility of C-C as an effective heat sink material for electronic packaging. Three to five carbon-carbon materials will be designed and analyzed in the required packaging configuration with appropriate mechanical and thermal loads applied. Based on the analysis results, one to three of the material designs will be selected and coupon test samples will be fabricated. Mechanical, thermal and physical property measurements will be made. Based on the analysis and test results one or more of these material designs will be selected for phase II development. An agreement has been made with Honeywell Space Systems Operation (Phoenix, AZ) to work with AMT to develop a product that will use C-C material for their spacecraft applications. BF Goodrich, a fabricator of high thermal conductivity C-C material, will be the material supplier for the phase I effort.