Low Cost, High Thermal Conductivity Electronic Packaging Material

Thermal Management has become the limiting factor in the advancement of many electronic systems. Current thermal management materials have either reached their performance limits or are impractical due to high costs. As applications for high density, high clock rate electronics increase, new cooling techniques and materials are required to allow low cost, high reliability operation. Technology Corporation has identified the opportunity to produce a low cost ( 180 W/mK). This loaded polymer system has the potential to produce heat sinks that cost less than one half aluminum with less mass and equivalent thermal performance. The specific technical aspects of this proposal are considered proprietary and are discussed in detail in the technical proposal. What is proposed is the combination of two mature technologies to produce 1) a high performance composite material at low cost and 2) polymer molding methods that are conducive to the bulk production of prismatic (e.g. heat sinks) and/or moldable geometric shapes. The proposal identifies the enormous market potential, both military and commercial, the developed material has. With the current packaging trends, smaller and faster, low cost high performance thermal management materials are in high demand. Military and Aerospace, automaotive applications, and electric powered vehicles require advanced cooling techniques for both motor controllers, integrated electronics, and power supplies.