Non-Hermetic Electronic Encapsulant Materials

The main objective will be to optimize the non-hermetic encapsulants that were developed and tested in the Phase I program. The Phase II research will result in an increase of the thermal stability so that these encapsulants will be capable ofwithstanding temperatures at the 600F level. Formulations, components concentrations, application and curing methods will be fine tuned. Among tests to be conducted will be moisture permeability, adhesion, thermal stability, thermal coefficientof expansion, thermal conductivity and physical properties. We will encapsulate a large number of electronic parts and our screening test results will be verified by our subcontractors and independent test laboratories. We will providematerials and process specifications for the innovative materials and process that will be developed during the proposed program. At the end of Phase II, UDC will provide a detailed report that will include all work performed, resultant data,specifications and a Phase III production plan.