High Strength Soldering Compounds Produced from Gas Atomized Powered Metal Alloys

Sn-Pb solder alloys used now to solder electronics fail from fatigue cracking. Attempts involving new binary and ternary alloys have increased strengths less than 10% over current solders. No substitute exists with higher mechanical strength yet melting below 210 degrees Celsius, compatible with electronics. Company proposes using novel gas atomized powders to join electronic componentry. Powders will be fabricated which effectively "melt" and fuse well below their known melt temperature. Through low temperature fusion of high temperature alloy powders, gains in solder joint strength exceeding 400% are anticipated. The objective is creation of a new solder substitute which exhibits superior strength though processed below 210 degrees Celsius to replace solder in electronic joints. The proposal also anticipates a lead free solder replacement and eliminating solders of different melting temperatures in step soldering.