Using Diamond Film Heat Spreaders and Microencapsulated Phase Change Materials for Electronics Cooling

This Phase I effort will investigate the feasibility of using microencapsulated phase change materials (microPCMs) together with diamond film heat spreaders to address the special heat-removal needs of high-power microelectronic packages. Previous research at Triangle Research and Development Corporation (TRDC) demonstrated excellent result swith new two-component microPCM coolants and composites. During USAF research, TRDC showed that microPCM coolants can enhance effective heat capacities by 50-200%, provide isothermal heat transport conditions, and lwoer pumping power and weight requirements. SBIR research programs for the Navy, Air Force, NSF, and NASA also demonstrated how microPCMs can increase the passive thermal capacitance of other materials and electronics by 1,000%. TRDC holds numerous patents for technology developed during this research. The proposed effort will study the user of microPCMs with diamond film heat spreaders for greater thermal conductance and distribution in advanced electronic packaging. North Caroline State university researchers who have demonstrated unique abilities to grow diamond films onto various substrates and geometries will work with TRDC to prepare and test the novel diamond film spreaders. Final tests will compare imporved heat transport and storage with electronic heat sink materials such as BeO and Aln.