SBIR/STTR Research Award

Improved Silicon on Insulator (SOI) Manufacturing Technology for Low Power, High Speed, Radiation Hard Devices

Award identifier f32b5ba0f34f7cfb647eb265394e0c183a85d052c93c6ef17bc73fc13914a3f0Awarding agency Department of Defense · Missile Defense Agency

Award amount

$59,503

Program and phase

SBIR · Phase I

Award year

1997

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Award details

Awarding agency
Department of Defense
Branch
Missile Defense Agency
Recipient company
ADVANCED FUEL RESEARCH, INC.
Proposal award date
Not reported
Contract end date
Not reported
UEI
E7PVK58C6UJ5
Solicitation number
Not reported
Topic code
Not reported

Research abstract

SOI technology offers the potential for creating radiation hard integrated circuits which can operate at low power and high speed. These advances are important for DoD and space applications and for battery operated devices. SOI is excellent for rad-hard applications because dielectric isolation of active circuitry from the supporting substrate by the Buried OXygen (BOX) layer enhances resistance to transient radiation effects by limiting charge collection volumes. Thin BOX (TBOX) layer material is particularly effective because the small dielectric region minimizes charge accumulation even further. An important technology for the production of SOI wafers is Separation by Implarltation of OXygen (SIMOX) developed by the Ibis Technology Corporation (Ibis). Research has shown that hardening processes developed for thermal oxides in bulk silicon technology (thermal oxide or fused silica) can be successfully applied to harden the SIMOX BOX if the BOX material properties (particularly density) can be made similar to those of thermal oxide. Also shown was that this matching of densities can be accomplished through the use of a supplemental oxygen implant. There are significant opportunities to speed rad-hard TBOX development, accelerate yield learning, improve quality, reduce scrap, lower costs, improve fabrication tool efficiency, reduce time to optimize fabrication tool operating parameters, reduce time to identify and correct faults, and reduce personnel, by the use of in-situ and in-line analysis of SIMOX wafers during processing. A number of recent developments suggest that Fourier Transform Infrared (FT-IR) spectroscopy can be an excellent analysis tool for monitoring and control of SIMOX fabrication. It is sensitive to thickness and composition of the layers (including the BOX layer density), it can be employed off-line for mapping and it can be employed in-line or in-situ in the ion implanter and the annealing oven. Measurements are made in seconds, and can be applied for in-situ diagnostics to guarantee product quality at each process step. Advanced Fuel Research, Inc., On-Line Technologies, Inc., and Ibis will develop FT-IR tools for in-situ control technology for SIMOX. Phase I will develop the F

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

248 SBIR/STTR records share this UEI (1983–2021). Reported award amounts total $48,007,871. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, Department of Energy, National Science Foundation, National Aeronautics and Space Administration, Environmental Protection Agency, Department of Commerce

Agency intelligence

Department of Defense

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