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Award details
- Awarding agency
- Department of Defense
- Branch
- Army
- Recipient company
- TRITON SYSTEMS, INC.
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- DA91DUWSMSQ7
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
A need currently exists within the U.S. Army for a more reliable, expedient, and cost effective method of joining fiber reinforced thermoset matrix Composite components in structural armor packages. Traditional methods involving adhesives and mechanical fasteners have not fully met this need. Triton Systems proposes to combine two recently developed composite processing technologies, diffusion enhanced adhesion (DEA) and induction heating, to offer a unique solution to this problem. The DEA process is a method of attaching a thermoplastic layer to a thermoset composite during the cure cycle. Induction heating of the thermoplastic layer then enables thermoplastic fusion bonding of thermoset composite components. This technology will be arnenable to rapid field repair of composite armor as well as more cost effective fabrication. Triton Systems also offers a unique method for controlled, uniform induction heating of the polymer. In the Phase I program Triton will optimize the susceptor design and induction coil parameters for effective bonding. The marriage of the two technologies will then be demostrated using a thermoplastic/thermoset system previously demonstrated with the DEA process. The successful Phase I demonstration will lay the ground work for the Phase II program in which a thermoset matrix structure will be fabricated. Successful development of the thermoset matrix induction bonding technologies will provide the Army with a method to make reliable low cost bonds between thermoset matrix composite component:; which are easily repairable in the field. Commercial applications extend from aircraft componenrs in the aerospace industry to high end sporting goods and marine equipment. The technologies are also applicable to heating of thermoset adhesives for more expedient and reliable thermoset bonds.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
Research funding history
927 SBIR/STTR records share this UEI (1993–2026). Reported award amounts total $388,500,403. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, Department of Homeland Security, Department of Health and Human Services, Department of Transportation
Agency intelligence
Department of Defense
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