SBIR/STTR Research Award

Miniaturized Scanning Electron Microscope

Award identifier d4818a8dc8208cc094c91bea1bc48f968b589316b7827a27b7e4efe567962cf3Awarding agency Department of Defense · Defense Advanced Research Projects Agency

Award amount

$98,967

Program and phase

SBIR · Phase I

Award year

2003

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Award details

Awarding agency
Department of Defense
Branch
Defense Advanced Research Projects Agency
Recipient company
Novelx
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

NOVELX, Inc. proposes to develop and market an innovative miniaturized modular scanning electron microscope (SEM) for commercial and military applications. The Phase I technical objective is to investigate the technical feasibility of building ahigh-resolution, low-cost, miniature SEM that combines high-performance imaging with a proven manufacturable process. The miniature modular SEM (mmSEM) will nominally operate at 1keV at 1nA and achieve <10nm resolution.Several novel technologies and innovations will be incorporated into the NOVELX column. The machined components and hand-wrapped electromagnetic coils, common to a conventional SEM, will be replaced by all electrostatic micromachined, batch-fabricatedsilicon components using micro-electromechanical systems (MEMS) technologies. Batch processing will drive the component costs down while MEMS micromachining and silicon technologies guarantee that the dimensions of the components will be deliveredprecisely as designed. These technologies also guarantee that all components will meet the specifications and exceed the required tolerances. The result will be predictable, uniform column operation.The silicon components will be packaged using advanced integrated packaging technologies. These technologies are commonly used to fabricate small packages with high density interconnects in high-volume production. The NOVELX design eliminates individuallywired interconnects common to conventional SEMS and replaces them with high density, batch-processed, printed circuitry. The mmSEM will be packaged in a tabletop or portable format and enable inspection of structures and devices, insulating and conductive, as well as biological materials with nanometer resolution.

Technology keywords

Not reported

Agency intelligence

Department of Defense

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