SBIR/STTR Research Award
NON-CONTACT TEMPERATURE SENSING FOR HIGH TEMPERATURE MANUFACTURING
Award amount
$50,538Program and phase
SBIR · Phase IAward year
1991Award details
- Awarding agency
- Department of Defense
- Branch
- Defense Advanced Research Projects Agency
- Recipient company
- K C Research Corpon
- Proposal award date
- Not reported
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- Not reported
- Topic code
- Not reported
Research abstract
NON-CONTACT RADIOMETRIC TECHNIQUES REPRESENT AN ATTRACTIVE SOLUTION TO THE DARPA TEMPERATURE MEASUREMENT PROBLEM BECAUSE THEY OFFER A TOTALLY NONINVASIVE MEASUREMENT TECHNIQUE WITH EXCELLENT TEMPORAL AND SPATIAL RESOLUTION. HOWEVER, CONVENTIONAL RADIOMETRICTECHNIQUES SUFFER FROM PERSISTENT TEMPERATURE MEASUREMENT ERRORS. THE PROPOSED NEW RADIOMETRIC TECHNIQUES ARE CAPABLE OF SOLVING THE TWO PRIMARY MEASUREMENT PROBLEMS IN RADIATION THERMOMETRY, UNKNOWN MATERIALEMISSIVITY AND REFLECTED BACKGROUND RADIATION. THESE INNOVATIVE NEW TECHNIQUES THEREFORE PROVIDE THE FOUNDATION FOR A NONINVASIVE TEMPERATURE MEASUREMENT AND CONTROL SYSTEM OF UNPRECEDENTED ACCURACY AND RELIABILITY FOR HIGH TEMPERATURE (1000 - 1500 DEGREES CENTIGRADE) MANUFACTURING PROCESSES. THE PROPOSED TECHNIQUES ARE BROADLY APPLICABLE AND NOTLIMITED TO ANY PARTICULAR CLASS OF MATERIALS, MANUFACTURING PROCESSES, OR ENVIRONMENTS. THE PHASE I RESEARCH STRESSES LABORATORY DEMONSTRATION OF THE PROPOSED NON-CONTACT RADIOMETRIC MEASUREMENT TECHNIQUES FOR CONDITITIONS AND MATERIALS WHICH SIMULATE RELEVANT HIGH TEMPERATURE MANUFACTURING PROCESSES, COUPLED WITH SIMULTANEOUS DIRECT TEMPERATURE MEASUREMENTS. THE PHASE I RESEARCH ALSO INCLUDES IDENTIFICATION AND EVALUATION OF PHASE II SENSOR DESIGN OPTIONS, PLUS DRAFTING OF ONE OR MORE PRELIMINARY PHASE II SENSOR DESIGNS. THE PROPOSED RESEARCH EFFORTWILL BENEFIT FROM OUR DIRECTLY RELATED EXPERIENCE IN INFRARED RADIOMETRY, NON-CONTACT TEMPERATURE MEASUREMENTS, AND DOD CONTRACTING. ANTICIPATED BENEFITS/POTENTIAL COMMERCIAL APPLICATIONS - IMPROVEMENTS IN PROCESS CONTROL RELATING TO HIGH TEMPERATURE MANUFACTURING OF SEMICONDUCTORS, COMPOSITES, AND MATERIALS FORMED BY RAPID
Technology keywords
Not reported