Metal-Metal Sealing Process for Robust Low-Cost MEMS Packaging

MicroAssembly Technologies Inc., with subcontractor, X-com Wireless, proposes the development of an RF micropackage suitable for a broad range of RF MEMS devices. The proposed effort leverages MicroAssembly's wafer level package, with yields of 90+%.Phase I work has demonstrated the package for RF applications. Originally intended for 2 GHz applications, the package shows reasonable performance up to Ka band, and will be optimized for high frequencies (K/Ka band)RF MEMS is projected to exceed $3billion by 2007 . MEMS packaging costs, up to 80% of production costs, is a key advantage for MicroAssembly.