Ultra Flexible Substrate

Current microelectronics relies on silicon substrate, ceramic packaging and fiber glass circuit board, devices built using this technology is costly and not flexible. Although foils (such as polyimide or steel) promised to address flexibility, they have tobe very thin. Sarcos has been working on a revolutionary technology that will enable electronic devices to be fabricated on filamentary and elongated prismatic flexible substrates which can be interconnected to form large area and even volumetric flexibleelectronics. The capability of flexible substrate to be folded, conformed to structure, woven or embedded means that the form factor of the electronic devices fabricated using this technology can also be changed, resulting in military capabilities notpossible before. So far we have developed and demonstrated a proprietary cylindrical lithography (CL) method for fabricating electronic devices on non-planar substrates (e.g. cylinders such as optical fiber, PZT tubes and NiTi shape memory alloy). Thisproject will expand the capabilities of CL. Solar cell, photodetectors corrosion sensors, embedded processors, mobile and concealed sensors, communications elements and other devices which are space, weight and power (SWAP) constrained.