LCP-Based Packaging of Exposed MEMS Sensors

"Over many years of development, the microelectronics industry yielded a broad set of advanced microelectronics packaging techniques. These techniques have been designed to increase the reliability of microelectronic devices under harsh operating conditionsby isolating the devices from the environment. However, these techniques are unsuitable for environmental MEMS sensors that require exposure to the environment. Humidity sensors and chemical sensors are two examples of MEMS sensors requiring this exposure.To meet the packaging needs of these devices, new package designs, packaging materials, and packaging techniques will be required. This Phase I effort will create package designs based on new materials and packaging techniques that will enhance thereliability of exposed MEMS sensors. Phase I will consist of materials compatibility studies, the development of package designs and concepts, and performance of prototype experiments to verify aspects of concept feasibility. A successful Phase I willlead to a Phase II effort that will develop prototype packages suitable for environmental testing and screening, as well as result in packaged MEMS sensors exposed to the environment. The packaging technologies developed under this effort will findapplication to a broad range of DoD and commercial applications that require exposed MEMS sensors. DoD applications include environmental monitoring suites, missile health monitoring devices, and c