NEW PACKAGING TECHNOLOGIES FOR SENSOR BASED (FIBER OPTIC) COMPUTER SYSTEMS

A NEW SENSOR CONFIGURATION HOLDS PROMISE FOR SIGNIFICANTLY IMPACTING THE INTERCONNECTIVITY CRISES AS IT RELATES TO PARALLEL SYSTEMS. THE NEED FOR AN ADEQUATE SENSING AND TRANSLATION (CAPABILITY) PATTERN RECOGNITION, ANY AUTOMATED DETECTION TECHNIQUE WHICH COULD ENABLE RESPONSES IN REAL TIME IS APPARENT. IT IS ANTICIPATED THAT INCREASED NUMBERS OF SENSORY ELEMENTS ABLE TO INTERACT WITH PROCESSING ELEMENTS WOULD ENABLE A SOLUTION TO ENHANCING PATTERN RECOGNITION AND REAL TIME SYSTEM OPERATION. THE ABILITY TO FABRICATE "SMART SKINS" PROVIDES THE POSSIBILITY OF RESOLVING SOME KEY TECHNOLOGICAL ISSUES IN AUTOMATION, ROBOTICS, ROBOTICS SYSTEMS, SENSING ARRAYS, IN ANY SYSTEM WHICH OPERATES PRIMARILY IN THE PERCEPTUAL, ACTION AND DECISION-MAKING DOMAINS. THE FABRICATION OF FIBER OPTIC MULTIPLE SENSORS IN A DENSE STRUCTURE CAPABLE OF SENSING DIFFERENT MODALITIES APPEARS FEASIBLE. IN THE PHASE I PORTION OF THIS PROJECT A FABRICATING METHODOLOGY FOR DEVELOPING A MULTISENSOR SYSTEM WILL BE TESTED. THIS "SMART SKIN" CONCEPT IS AN INNOVATION FOR THE PHYSICAL REALIZATION OF COMPLEX SENSOR BASED, REAL TIME SYSTEMS. THIS PROPOSAL ADDRESSES THIS QUESTION.