Gradient Morphology Hybrid Resins for Rigid-Flex Printed Wiring Board Adhesives

A novel ceramic-modified terpolymer resin is proposed which can be readily cured to a tough, thermal shock resistant interpenetrating polymer network (IPN) having a gradient morphology. The proposed research explores the feasibility of modifying conventional epoxy novolac resins with silicate ceramic precursors and rubber toughening agents to produce a new class of semi-vitreous materials for bonding the dissimilar substrates used in rigid-flex printed wiring board fabrication. The polyer-modified ceramics or ceramer adhesives are design to cure without evolving volatile byproducts and with a minimum of bondline shrinkage and void formation. The resins should have the unique ability to partially phase separate during cure. The resulting gradient IPN morphology should imbue these adhesive materials with strong affinities for both metallic an non-metallic substrates, high resistance to hydrolysis, and outstanding thermal shock stability. In the proposed study, the methodology for preparing these novel ceramic hybrids will be developed and their ability to be cured into strong, water resistant, adherent and thermally stable materials demonstrated. A literature survey of other candidate materials for this adhesive bonding application will also be performed. OPTION: None submitted.