SBIR Phase II: Integrated Lens-Laser Packaging Approach

This Phase II Small Business Innovation Research project is to develop an integrated optical and electrical packaging technique that allows for the precision placement of high density, large arrays of VCSELs, LEDs, or photodetectors coupled with arrays of microlenses. The project extends the limits of integration for device to device pitch, and device counts, of VCSELs and microlenses that have not previously been achieved. This innovation has immediate application to existing computed radiography, scanning and printing applications. The computed radiography market is $1B annually, and is shared by U.S. and Japanese companies. The proposed innovation enables smaller, more reliable and higher resolution systems. In the long run, the application of precision optical assembly techniques may have an impact on the revolution taking place in chemical, biological and medical analytical instrument and sensing devices.