NOVEL DIAMOND/C/C COMPOSITES FOR THERMAL MANAGEMENT

AN INNOVATIVE INTEGRAL DIELECTRIC HEAT SINK MATERIAL, DIAMOND/CARBON/CARBON COMPOSITE, IS PROPOSED IN THIS PHASE I RESEARCH FOR THE USE IN FUTURE ADVANCED ELECTRONIC DEVICES. CARBONE/CARBONE COMPOSITE HAS A HIGHER THERMAL CONDUCTIVITY AND LOWER DENSITY, AND THEREFORE A HIGHER SPECIFIC THERMAL CONDUCTIVITY, AS COMPARED TO METALS. HOWEVER, CARBON IS ALSO AN ELECTRIC CONDUCTOR. WE PROPOSE TO APPLY DIAMOND COATINGS TO THE CARBONE SUBSTRATE FOR INSULATION. DIAMOND COATINGS NOT ONLY PROVIDE AN INSULATING LAYER BUT ALSO AVOID A THERMAL BARRIER THAT IS GENERATED BY THE CONVENTIONAL ELECTRICALLY-INSULATING COATINGS. IN ADDITION, THE USE OF A DIAMOND COATINGS CARRIERS AN OPPORTUNITY THAT ELECTRIC CIRCUIT PRINTS COULD BE DONE DIRECTLY ON THE HEAT SINK MATERIAL. IN THIS PROPOSED PHASE I RESEARCH, WE WILL FIRST FABRICATE CARBONE/CARBON COMPOSITES BY A CHEMICAL VAPOR INFILTRATION (CVI) TECHNIQUE. DIAMOND WILL THEN BE DEPOSITED ON AND INTO THE COMPOSITES BY A PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD) TECHNIQUE. VARIOUS ANALYSIS WILL BE CARRIED OUT TO EVALUATE THE RESULTING COMPOSITES. UPON THE COMPLETION OF THIS PROPOSED PHASE I RESEARCH, A REVOLUTIONARY HEAT SINK MATERIAL WILL BE DEMONSTRATED.