Non-Hermetic Electronic Encapsulant Materials

Our main objective will be to investigate and develop an affordable, high performance organic material formulation and application/molding process that will significantly advance the state-of-the-art in current encapsulation material performance fornon-hermetic integrated circuits (ICs). The new encapsulants will be permeable to moisture and have controlled coefficient of thermal expansion (CTE) and modulus of elasticity properties that minimize stress between the printed circuit board (PCB)substrate and integrated circuit. Fillers will be used to improve thermal conductivity and reduce the thermal expansion coefficient. Additives will be used to improve the adhesion and fire retardance. The developed encapsulants will be tested by theencapsulation of small parts by UDC and testing by end users. At the end of Phase I, we will provide a report with results and conclusions, and a Phase II plan, schedule and cost estimate.This program will provide a high performance non-hermeticelectronic encapsulants. These encapsulants will improve the performance, lower the cost, and improve reliability of nearly all electronic components used in weapon systems. Encapsulants for microcircuits are urgently needed throughout the commercialsector as well as in defense. Examples include computers, cell phones, and all devices with microcircuits. This technology will provide lower cost and higher performance in all of these applications.