REACTIVE COUPLING AGENTS FOR IMPROVED ADHESIVE BONDS

A FAMILY OF REACTIVE COUPLING AGENTS BASED UPON AN EXOTHERMIC DECOMPOSITION IS BEING DEVELOPED. THE REACTION MAY BE INITIATED THERMALLY OR WITH ACTINIC LIGHT. INITIATION MAY BE VARIED OVER A WIDE RANGE OF TEMPERATURES OR WAVELENGTHS, WHICH ALLOWS THE BONDING REACTION TO BE TAILORED TO THE ADHESIVE CURE PROCESS. EARLY STUDIES HAVE SHOWN THE FEASIBILITY OF USING THIS CHEMISTRY TO BOND TO METALS, CERAMICS AND POLYMERS. THE PROPOSED PHASE I PROGRAM WILL EXTEND THE DATA BASE TO SUBSTRATE OF INTEREST TO THE U.S. ARMY AND EXAMINE THERMAL AGING EFFECTS ON COUPLING AGENT/PRIMER SOLUTIONS AND BONDED JOINTS. DURABILITY OF BONDED JOINTS EXPOSED TO HOT-WET CONDITIONS WILL ALSO BE EXAMINED. THESE DATA WILL DICTATE PACKAGING CONCEPTS AND DEMONSTRATE THE POTENTIAL FOR OBTAINING MORE RELIABLE AND DURABLE ADHESIVE JOINTS USING THE REACTIVE COUPLIG AGENT WITH COMMERCIALLY AVAILABLE ADHESIVES.