High Channel Density Interconnect Modules for Air Platforms

The primary goal of the proposed Phase I SBIR effort is to develop high channel-density interconnect modules for use in air platforms. This will be accomplished using a unique, monolithic, WDM, optoelectronic module that has a high interconnect density,small form-factor, and is rugged enough to withstand harsh operating environments. OptiComp Corporation occupies a 7,000 square foot facility, which includes a full service, backend semiconductor fabrication cleanroom and optoelectronic device integrationlaboratory, a optoelectronic testing area, and a MBE-based growth facility. OCC's design center includes optoelectronic device modeling and design, growth, fabrication, integration, and testing capabilities. The proposed program will offer a dual use commercialization opportunity for providing dense interconnects in a harsh operating environment, such as in commercial and military aircraft. The ruggedized, small form-factor modules will reduce fiber-countand electromagnetic interference through the use of coarse WDM. This interconnect scheme has significant market potential as the demand for data-capacity increases.