Thermomechanical Characterization System for Mixed Technology Electronic Assemblies

One approach to wider use of mixed mode technology requires polymer-based packaging materials, which place greater demands on the thermomechanical performance of the package design. Electronic Packaging Services (EPS) proposes to develop a commercial instrument for the experimental measurement of out-of-plane thermal displacements in populated mixed mode electronic assemblies. The system will be based on shadow moire, a full-field non-contact optical technique. Phase stepping analysis, which convolutes multiple moire fringe images with fixed phase differences between them, extends the resolution in out-of-plane displacement measurement below 0.1 mils, automatically identifies contour maxima and minima, and reduces interference from permanent optical features. The sample will be held within an oven combining radiant and convective heating to allow computer-controlled simulation of a variety of manufacturing and testing processes. This project is an extension of analytical services currently provided by EPSto electronics manufacturers. The Phase I objective is construction of a fully-functional laboratory prototype. Specific technical aims include increasing speed and robustness of automated analysis algorithms, handling regions occluded by components, cut-outs, and other features, demonstrating localized heating simulation approaches, and identifying useful reporting formats for out-of-plane displacement information.