High Performance Passive Flexible Cryogenic and Ambient Heat Transport Material (kTC P203)

"Flexible cryogenic and ambient cooling is essential to meet emerging requirements for advanced systems and is enabling technology for increasingly compact / higher density Air Force and Department of Defense infrared sensing payloads. k TechnologyCorporation (kTC) proposes a general technology development that permits the design of a high performance passive flexible cryogenic and ambient heat transport material. The conductivity of the proposed material system will exceed 1000 W/mK at alltemperatures between 5 and 300K. In addition, the proposed technology development will allow the material system to be tailored and optimized for any temperature in this range at greater conductivity values. This proposed effort will develop a materialsystem that can be specifically designed to satisfy Air Force requirements. The encapsulated APG foils to be demonstrated under this program would have applications in the commercial satellite market, as well as the obvious military and NASA uses. Keypotential post application relies heavily on the successful verification and certification of the proposed materials' performance. With increasing acceptance, encapsulated APG will be attractive to automotive and power supply manufacturers. Enablingtechnologies will allow the increase of production and the realization of the economies of scale."