INNOVATIVE ELECTRONICS PACKAGING FOR ARTILLERY FUZES

SYSTEM CONFIGURATIONS OF ARTILLERY PROJECTILE FUZES ARE FORCING A REDUCTION IN SIZE. THE PURPOSE OF THIS PROGRAM IS TO IDENTIFY ALTERNATE PACKAGING APPROACHES (E.G., COD, HERMETIC CHIP CARRIERS, TAB, WAFERSCALE, ETC.) THAT COULD BE USED TO MINIATURIZE FUTURE DESIGNS. SINCE THE ENVIRONMENTAL STRESSES IMPOSED ON THE FUZES IN THE ARTILLERY PROJECTILE APPLICATION ARE EXTREMELY SEVERE, IT WOULD BE USEFUL TO DETERMINE WHICH PACKAGING CONCEPTS ARE VIABLE. THIS CAN BE ACCOMPLISHED BY FIRST MODELING (FINITE ELEMENT ANALYSIS) THE CONFIGURATIONS AND THEN SELECTING THE MOST PROMISING CANDIDATES FOR A COMPREHENSIVE ENVIRONMENTAL TEST SEQUENCE.