Thermal Management

"With both the increasing density of semiconductor devices and the increasing power from these devices, substrates having high thermal conductivity will be needed. This program proposes an innovative materials that has thermal conductivity higher than 500W/m¿K, CTE matches to Si or GaAs, and remains cost effective. A common problem in the design of microelectronic packages, however, is that material candidates having high thermal conductivity also have a high CTE. The uniqueness of this compositematerial is that the carrier substrates can be tailored to match the thermal expansion characteristics of the chip or other heat-generating components attached to the carrier substrate which also providing improved heat transfer. The innovative materialin this program is a technology that enables electronics to acheive higher speeds, smaller size and higher reliability. High thermal conductivity heat sink materials are primarily found in fiber optic components in internet related applications whichinclude amplifiers, receivers, transmitters, tunable lasers, modulators. Other areas of application include RF power package components that are used in wireless telecommunication infrastructure for cellular phones, base stations, high definitiontelevision (HDTV), and satellite communications."