Epoxy Flip Chips For MCMS

Research and development of an epoxy flip chip technology is proposed that has several advantages over the C4 solder bump flip chip. Firstly, it requires less capital investment and NRE costs. Secondly, the process itself is far less complicated. Thirdy, it may be more reliable than the solder bump process. The siginificant advantage of this epoxy flip chip technology is its affordability for production implementation for small companies. This should make MCM manufacturing available to a broader community. The feasibility and reliability of this process will be investigated by developing an application process and hardware for optimum epoxy bump geometries, evaluating commercially available robotic systems for final assembly, and testing a specailly designed package that will include a silicon test chip and PGA ANTICIPATED BENEFITS: After the successful development of an epoxy flip chip, potential applications would be a cost effective replavement for solder bump flip chips used in MCM. Other applications may include interconnects for back side illuminated detectors for primarily military applications.