Development of High Temperature Low Cure Shrinkage Adhesive

The objective of this program is to develop high temperature adhesives with reduced cure shrinkage. The formation of polymers from smaller monomers is usually accompanied by a reduction in volume of the final polymer network. This shrinkage creates internal strain in the resin, creates internal defects, and adversely affects the mechanical and durability of the polymer and adhesive bond. We propose to formulate experimental adhesives with novel monomers, which expand upon cure, thereby reducing or eliminating polymerization shrinkage inherent in conventional polymer systems. A series of computational, chemo-physical and mechanical characterization tests will be used to confirm the feasibility of this concept.