SBIR/STTR Research Award

MILLIMETER WAVE PACKAGING OF OPTOELECTRONIC COMPONENTS

Award identifier e84a3699619c9987e3be9d9af477ca51a3048cbc130eafd359ea9949ef96080dAwarding agency Department of Defense · Navy

Award amount

$49,928

Program and phase

SBIR · Phase I

Award year

1989

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Award details

Awarding agency
Department of Defense
Branch
Navy
Recipient company
Ortel Corp.
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

CURRENT DEVICE TECHNOLOGY IS PROGRESSING TO THE POINT THAT NEW PACKAGING TECHNIQUES ARE REQUIRED TO ALLOW THE FULL HIGH SPEED CAPABILITIES OF THESE DEVICES TO BE USED. CURRENT FIBER OPTIC PACKAGING IS LIMITED BY MECHANICAL CONSIDERATIONS TO BELOW 20 GHZ. NEW PACKAGE DESIGNS ARE NEEDED TO PUSH THE FREQUENCY CAPABILITY OF THESE DEVICES INTO MILLIMETER WAVE USES. WE PROPOSE TO BEGIN THIS RESEARCH WITH A FIBER-COUPLED PACKAGED PHOTODIODE DESIGNED TO WORK AT 30 GHZ.

Technology keywords

Not reported

Agency intelligence

Department of Defense

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