SBIR/STTR Research Award

Implantable Electrical Interconnects for Biosensors

Award identifier 43db61e9071321a5debb958174b7c2a75ffeaebf37b8c93deb07209279635b58Awarding agency Department of Health and Human Services · National Institutes of Health

Award amount

$140,000

Program and phase

SBIR · Phase I

Award year

2001

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Award details

Awarding agency
Department of Health and Human Services
Branch
National Institutes of Health
Recipient company
INTEGUMENT TECHNOLOGIES, INC.
Proposal award date
Not reported
Contract end date
Not reported
UEI
C4AZFTU2YRM9
Solicitation number
Not reported
Topic code
Not reported

Research abstract

DESCRIPTION (provided by applicant): A key issue for most implantable micromachined sensor concepts being developed in the Neural Prosthetics Program (NPP) at the National Institutes of Health (NIH) is how they are to be interconnected with percutaneous connections or implanted telemetry units. A robust, ultrafine, microribbon interconnect may enable many of today's advanced biomedical sensor for clinical applications. The work proposed will focus on developing a hydrolytically stable, corrosion resistant, fluoropolymer/silicone composite ribbon cable to be used as a novel "Implantable Electrical Interconnect for Biosensors." Two well-known classes of implantable materials, silicones and fluoropolymers, will be combined in this effort. By coupling innovative polymer surface modifications, a series of unique fluoropolymer materials will be fabricated that will have exceptional surface adhesion properties capable of forming strong bonds to both: (1) vacuum sputtered Au and Pt metal and, (2) to commercially available silicone adhesives and coatings. Using standard photo-resist based photolithography methods, conducting micropathways of metal circuitry will be fabricated onto thin fluoropolymer ribbons and then hydrolytically sealed via the covalent bonding of a Pt catalyzed silicone material. PROPOSED COMMERCIAL APPLICATION: Based on results, these electrical interconnects (and cables) will have direct applications into current technologies being developed within the NPP. Additionally, good results will also demonstrate the effectiveness of these materials that will allow us to market the technology into a variety of industrial applications that utilize electronic and microelectronic components to be used in harsh, corrorsive environments currently under development within the United States Military sensor programs.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

19 SBIR/STTR records share this UEI (1999–2016). Reported award amounts total $5,620,235. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, Department of Health and Human Services

Agency intelligence

Department of Health and Human Services

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