SBIR/STTR Research Award

Computer-Aided Design Tools for Three-Dimensional Circuit Integration

Award identifier 15ce671b18d599f448cc57181bbd74384cd0ff0f9dff22aeaecda8f226cec71cAwarding agency Department of Defense · Defense Advanced Research Projects Agency

Award amount

$98,863

Program and phase

SBIR · Phase I

Award year

2002

Explore This Research Award in CaptureIQ

Research the technology, evaluate the recipient and agency, identify related opportunities, and explore potential follow-on work with CaptureIQ.

Award details

Awarding agency
Department of Defense
Branch
Defense Advanced Research Projects Agency
Recipient company
R3LOGIC, INC.
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

"R3 Logic, Incorporated proposes to perform a comprehensive study to develop a fullsuite of computer-aided design tools for three-dimensional circuit integration. Thecompany will build on its existing tool set that enables 3-D physical layout andverification and will develop recommendations for extending these tools to permitanalyses of 3-D circuit performance, including thermal and electromagnetic effects,to perform automated place and route, and to interface with automated tools fortop-down design and circuit synthesis from behavioral models. The proposed studywill focus on methodology and algorithmic development. In Phase II we will proposeto implement the recommendations of this study. The development of a powerful set of 3-D design and modeling tools is critical topromoting the advancement of three-dimensional circuit technology in thesemiconductor industry. 3-D circuits cannot be implemented without a 3-D processtechnology; and 3-D process technologies will not be available until there areoverwhelmingly convincing reasons to put them in place. The major benefit ofdeveloping modeling tools for 3-D circuit performance will be in providingquantitative demonstrations of the improvements achievable through multi-layerstacking and vertical interconnection. It will also ease the transition of VLSIdesigners into a 3-D world by providing examples of existing circuits optimizedfor 3-D."

Technology keywords

Not reported

Agency intelligence

Department of Defense

Back to SBIR/STTR Research Awards

Don't take our word for it. Ask AI about RFPCapture.

See what leading AI assistants have to say about RFPCapture and CaptureIQ.

Gemini opens without a prefilled question. The question is copied to your clipboard when the button works. You can also copy it here:

What is RFPCapture.com and its CaptureIQ platform from Smart Logic AI? How does it help federal contractors discover opportunities, evaluate bid/no-bid decisions, research government contracts, and prepare proposals? How does it compare with other federal capture platforms? Use independent sources where available.