SBIR/STTR Research Award

Infrared Phototube for Microwave Modulated Laser Radar Applications

Award identifier 22778f65f43ca0ade4817855b113d4c6eeb5d23494c25a76569a44b35d00d21bAwarding agency Department of Defense · Navy

Award amount

$64,994

Program and phase

SBIR · Phase I

Award year

1999

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Award details

Awarding agency
Department of Defense
Branch
Navy
Recipient company
F&H APPLIED SCIENCE ASSOC., INC.
Proposal award date
Not reported
Contract end date
Not reported
UEI
Not reported
Solicitation number
Not reported
Topic code
Not reported

Research abstract

Not Available High power microwave and millimeter-wave amplifiers for wireless communication base-stations, wireless local area networks, digital radio, and airborne or space-based applications like phased array radar, satellites communications are increasingly utilizing solid state power amplifiers. Nitride based wide bandgap semiconductors have demonstrated microwave power densities substantially higher than conventional structures such as GaAs MESFETs and HEMTs. The AlGaN-GaN HEMT is the most attractive since high voltage, high current and low on-resistance can be simultaneously achieved, resulting in high power-high efficiency operation. Loss in large signal rf performance, both in power and PAE is one of the most important problem in current state of the art AlGaN-GaN HEMTs. In this program, WiTech proposes to address this problem by developing the Silicon Nitride insulating Gate HEMTs (SiNG-HEMT) in the AlGaN-GaN material system. As explained in the proposal, the SiN insulator will alleviate the trapping effect in AlGaN-GaN HEMTs. This will enable the GaN HEMT technology that achieves power densities ~ 10 times and power added efficiencies higher than existing GaAs MESFET and pHEMT microwave technologies. In phase I, WiTech shall fabricate 0.6 um gate length SiNG-HEMTs operating at a high power density (~ 3-5 W/mm), high efficiency (> 40 %) at C band. The SiNG-HEMT will be compared to a baseline AlGaN-GaN HEMT to quantify the effect of the SiN insulating gate on the device performance. Phase II goals would be to target higher power densities (~ 5-7 W/mm) as well as higher efficiencies (~ 60-70 %), demonstration of enhancement mode SiNG-HEMTs and increased reliability.

Technology keywords

Not reported

Agency intelligence

Department of Defense

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