Low Light Level Solid State Sensors

In this proposal, Fermionics Corporation will fabricate 2.0 ¿m, high temperature HgCdTe focal plane array (FPA) cameras for the U.S. Army. The FPA will be in the form of a hybrid with a dimension between 360x480 to 480x640. During phase I, we will optimize three techniques to produce 64x64, 2.0 mm, 230¿-300¿K, HgCdTe arrays with pixel sizes from 10 to 20 mm. These arrays will then be hybridized to fan-out chips and be extensively tested. A readout circuit designer will be selected for designing the multiplexer. The criteria of the mux designer is the capability of designing mux with small pixel size, low noise, and preferably digital signals. An IR camera producer will also be selected. In Phase II, all of the components will be manufactured and a camera will be built. In Phase III, the IR cameras will be commercialized. The new FPAs will be the advanced version of current image intensifier for military applications. They will also find markets in astronomy, nuclear detector imaging, medical studies, and spectroscopy. The FPAs may also be used in automobiles for collision avoidance and to provide warnings for hazardous road conditions.