SBIR Phase II: An Optical Sensor for Semiconductor Back-End Processes

This Small Business Innovation Research (SBIR) project is to develop innovative miniature con-focal laser scanning sensors for semiconductor packaging processes by using diode laser detector array chips. There are no moving parts in this sensor for scanning, unlike other con-focal devices. This sensor with a fast imaging rate will be integrated with chip IC placement robot machines, to inspect solder bump co-planarity of Flip Chip Bonding (FCB) and the ball of Ball Grid Arrays (BGA) before packaging. BGA and FCB are used in mission critical devices in airplanes and medical devices. To ensure quality of the packaging, semiconductor-packaging companies demand lower cost, smaller, fast imaging optical sensors in the automatic optical co-planarity inspection instruments to ensure the reliability and quality of package assembly. The electronics industry's demands for increasing circuit density, higher levels of integration and improved cost/performance capabilities have led to the proliferation of the use of BGA and FCB. This will reduce chip failures and system failures. These high reliability devices may eventually save lives and improve the quality of life.