Global (N4) Free Space Optical Interconnection Packaging Technology

The proposal program will demonstrate packaging technology in an optical interconnect device consisting of at least 64 parallel interconnections between stages. The packaging will allow a 1 GHz bandwidth, micro-optoelectronic switch to survive in a 50 g (gravity) shock and vibration environment. OptiComp's enabling GaAs "Smart" optoelectronic interconnect modules will be used in the proposed optical packaging scheme. High speed inter-chip interconnects are obtained without the power requirements and cross-talk limitation of electronic circuitry. The global (N4) architecture will provide support for a shipboard optical communications networks, etc.). The program emphasizes packaging methodology development for the hybrid integration of: - GaAs vertical cavity surface emitting laser (VCSEL) arrays; - Diffractive optical interconnect elements (DOIEs); and - 2D arrays of a metal-semiconductor-metal (MSM) detector/transimpedance amplifier. During Phase II, the optoelectronic packaging technology will be further developed for shipboard beta testing for an application to be selected by the Navy. Several models will be fabricated during this phase of the program. Technology transfer in Phase II will be focused toward asynchronous transfer mode (ATM) switching fabrics for dual-use commercial applications such as local area and wide area networks (LANs/WANs).