SBIR/STTR Research Award

Nonmetallic Compliant Conductive Materials for Airframe Electrical Continuity

Award identifier 30224fd837d2c5b6a81be359bef855cfdc83a963418b224d3d646772efd6585eAwarding agency Department of Defense · Army

Award amount

$729,963

Program and phase

SBIR · Phase II

Award year

2003

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Award details

Awarding agency
Department of Defense
Branch
Army
Recipient company
Eikos, Inc.
Proposal award date
Not reported
Contract end date
Not reported
UEI
X2J1C6N7K4A6
Solicitation number
Not reported
Topic code
Not reported

Research abstract

Eikos Inc. successfully demonstrated the use of carbon nanotube additives to polymer based systems, Nanoshield¿, to tailor electrical conductivity and provide electromagnetic shielding. In Phase I, Eikos used its Nanoshield¿ technology to provide 40 dB EMIshielding in a very low resistivity (<10 Ohm/sq) thin coatings on a glass/epoxy composite panels. Additionally, conductive gaskets and composite interlaminar conductive structures were demonstrated utilizing the same technology. The small amounts of carbonnanotubes required for Nanoshield¿ have minimal effects on base materail properties and cost unlike the standard metallic fillers employed today. The need for high shear strength compliant polymer systems which can provide electrical continuity isparamount for effective airframe deign. In Phase II Eikos Inc. will advance the development of this technology by working closely with Sikorsky Helicopter to apply this coating technology to meet three areas identified for application on the ComancheHelicopter. All three represent opportunities to reduce weight, increase durability, and reduce production and maintenance cost. Specifically the Phase II program will utilizes the technology demonstrated in Phase I to: 1) replace copper mesh in embeddedground plan composite panels, 2) replace metallic filled adhesives and gaskets sealing access panels throughout the fuselage. Successful implementation of this technology will result in a new generation of conductive materials capable of disruptingcurrent conductive materials used in consumer electronic like cell phone pagers, and PDA. Other areas for insertion are circuit board ground planes, conductive backplanes on flexible displays, and in the future, flexible circuit.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

48 SBIR/STTR records share this UEI (1997–2014). Reported award amounts total $12,797,408. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Health and Human Services, National Science Foundation, Department of Commerce

Agency intelligence

Department of Defense

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