SBIR/STTR Research Award

Inherently EMI Shielding Conformal Coatings

Award identifier 3ff9e3b3d54e67a8e90bee0515a6c14ccb60b1e101bf4cc425d732143cfc918bAwarding agency Department of Defense · Army

Award amount

$728,986

Program and phase

SBIR · Phase II

Award year

2003

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Award details

Awarding agency
Department of Defense
Branch
Army
Recipient company
Eikos, Inc.
Proposal award date
Not reported
Contract end date
Not reported
UEI
X2J1C6N7K4A6
Solicitation number
Not reported
Topic code
Not reported

Research abstract

Smart munitions, unmanned vehicles, and the total integration of air, ground, and sea forces has generated a significant need for advanced electronics. The drive for compact electrical systems, reduced weight, and increased heat dissipation has taxed theElectrical Engineer. A prominent area requiring technology advancement is treatment of Printed Wire Boards (PWB) to provide environmental and EMI protection. Traditionally, polymer based conformal coatings are used to seal and protect PWB's fromenvironmental exposure with metallic enclosures added to provide EMI shielding. An industry target is to enable the conformal coating to provide the EMI protection as well. The maturation of carbon nanotube technology is enabling such a multifunctionalcoating. In Phase I, Eikos demonstrated the use of carbon nanotube additives to achieve EMI shielding of 40dB in a standard conformal coating resin. The resulting multifunctional coating is entitled Nanoshield¿. The small amounts of carbon nanotubesrequired for Nanoshield¿ have minimal effects on base coating properties and cost. Nanoshield¿ has demonstrated compatibility with commercially available conformal coatings and application equipment. Eikos with Northrop Grumman support proposes a phase IIprogram to demonstrate a multifunctional coating and implementation plan to reduce mass, volume, and cost of advanced electronic systems. Imparting EMI shielding to conformal coating eliminates the need for metallic enclosures integrated into PWB. Thiswill significantly reduce the size and weight of electronic systems. Achieving this goal will result in smaller computer envelopes, more payload capability of aircraft, and more effective cooling of densely packed electronic systems.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Research funding history

48 SBIR/STTR records share this UEI (1997–2014). Reported award amounts total $12,797,408. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Health and Human Services, National Science Foundation, Department of Commerce

Agency intelligence

Department of Defense

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