LOW DIELECTRIC CONSTANT PACKAGING MATERIAL FOR MULTICHIP MODULES

A LOW DIELECTRIC CONSTANT PACKAGING MATERIAL FOR USE IN THE FABRICATION OF MULTICHIP MODULES IS PROPOSED. TWO FORMS OF THE MATERIAL WILL BE DEVELOPED. A FIRST FORM WILL HAVE A DIELECTRIC CONSTANT OF 2.4 AND A SECOND, MORE ADVANCED FORM, WILL HAVE A DIELECTRIC CONSTANT LESS THAN 2.0. THE PROPOSED PROGRAM WILL INCLUDE DEVELOPMENT OF THE MATERIAL AND DEMONSTRATION OF THE MATERIAL FOR USE IN MULTICHIP MODULES. TO DEMONSTRATE FEASIBIILTY CANDIDATE DIELECTRICS WILL BE SUBJECTED TO A BATTERY OF ACCELERATED STRESS TESTS INCLUDING SEVERE THERMAL SHOCK, ACCELERATED THERMAL AGING, BOILING WATER AND ADHESION. OTHER COUPONS WILL BE CHARACTERIZED FOR DIELECTRIC CONSTANT AND LOSS FACTOR TO >20 GHZ. PROCESSING RELATED CHARACTERISTICS WILL ALSO BE DEMONSTRATED/EVALUATED INCLUDING ABILITY TO COAT AND CURE MATERIAL AND FORM HOLES WITH LASER ABLATION.