Fabrication and Testing of Multichip Modules Using Epitaxial Liftoff Technology

We propose to use epitaxial liftoff techology and patterned overlays to develop new approaches to multichip module fabrication and testing that will facilitate in process testing and improve thermal management of dense multichip modules (MCMs). Thin, single-crystal semiconductor films can be produced with epitaxial liftoff technology. The films can be used to improve several features of MCMs and improve the manufacturing process. Some potential advantages are improved thermal management, higher density packaging, inprocess testing and repair, application to optoelectronic devices, and flexible or nonplanar packages. Patterned overlays can be used with epitaxial films to provide mechanical support, electrical interconnection and interim testing as the MCM is assembled. In this program, we will combine these two technologies to develop a process which maintains the advantage of each separate technology and facilitate inprocess testing and repair of multichip modules. During Phase I we will perform feasibility experiments to demonstrate the enabling technology, and will design a demonstration MCM to be fabricated in Phase II. Anticipated Benefits: This development will allow increased density of electronic integration by improving thermal dissipation and lead to improved inprocess testing of multichip electronic and optoelectronic devices. It will also develop the ability to package and interconnect semiconductor electronics and optoelectronics in flexible, nonplanar, or even pakcages of stacked integrated circuits.