Novel Glass/Glass-Ceramic Material for Electronics Packaging

This Small Business Innovation Research (SBIR) Phase I project proposes to address electronics packaging constraints, the limiting element in system cost and performance for further advancements in commercial and defense electronics. Traditional packaging approaches to address the needs in these markets, including FR4, liquid crystal polymers, and Low Temperature Co-Fired Ceramics, are running into fundamental material limits. Market needs are pushing for smaller package volumes, higher density interconnects, in-package thermal management and ultimately optical waveguide capability. This proposal will investigate the feasibility of using an innovative glass ceramic material as a packaging solution for these electronics applications. This material is processed using first generation semiconductor equipment in a simple three- step process and the product can be formed into glass, ceramic, or regions of both glass and ceramic. This Phase I study will focus on three tasks. First, demonstrate the material can be used for high-pressure microfluidics (1500 psi) for enhanced thermal management. Second, the glass ceramic will be fabricated to demonstrate 10